Free listingManual entrySummer internshipHong Kong

2027 Software Engineering Intern

Schonfeld

Ten-week 2027 summer internship with a Schonfeld Technology software engineering team in Hong Kong (Treasury Technology: securities lending, financing, repo, FX hedging, collateral and margin systems). Interns get a manager and mentor, a summer-long project and may receive a full-time offer. Official Greenhouse posting 8346891 (first published 2026-11-11) checked on 2026-11-12.

Application deadline

Status at last verification
Deadline not confirmed
Recorded closing date
Not confirmed
Recruitment cycle
2027
Location
Hong Kong

No closing date is recorded on the observed source.

How to apply

Apply through the employer’s official careers page linked above.

Applications happen on the employer's channel. Pathline never processes applications and never guarantees that a listing is still open — check the official page.

Recorded eligibility notes

  • Student pursuing a degree in a technical or quantitative field
  • Demonstrated software engineering skills from internships, coding competitions or publications
  • Experience in a programming language such as C++, Java or Python; basic Git and databases
  • Interest in capital markets or finance (prior finance experience not required)

Entered by an operator from the official page. Full requirements are on the official page.

What to check at source

The official posting states no application deadline and may close without notice. No visa sponsorship or work-eligibility policy is stated; non-local students should confirm work eligibility with the employer.

Sources and review record

Source publisher
Pathline operations (manual entry)
Entry type
Entered by an administrator and checked against the official page on 2026-11-12. No automated observation snapshot.
Last verified
Reuse permission
Facts, original summary and link only — content is not reproduced

Source registry status: active · checked every 30 days · review queue

Recorded facts

  • Schonfeld Greenhouse job 8346891 “2027 Software Engineering Intern”, location Hong Kong, first published 2026-11-11; ten-week internship; no deadline or visa policy stated. Checked 2026-11-12. Source ↗